Browse Job Titles
Job Title: Wafer Abrading Machine Tender
Wafer Abrading Machine Tender Job Description:
Tends abrading machines that roughen surface of semiconductor wafers to distinguish front from back: Adjusts controls to set speed, time, and pressure of abrading belts according to specifications. Loads container of wafers into abrading machine and starts machine that automatically abrades surface of wafer. Removes abraded wafers from machine and inspects wafers to detect abrading defects, such as cracks, using microscope. Replaces worn abrading belts.
Wafer Cleaner
Tends equipment that cleans surface of semiconductor wafers after slicing or polishing: Reviews work...
Plater, Printed Circuit Board Panels
Electroplates printed circuit board (Pcb) panels with metals, such as copper, tin, gold, nickel, or ...
Deburrer, Printed Circuit Board Panels
Feeds and off bears machine that automatically cleans and removes burrs from panels for production o...
Production Technician, Semiconductor Processing Equipment
Cleans and maintains wafer processing machines and equipment and mixes chemical solutions, following...
Tool Programmer, Numerical Control
Operates optical programming (digitizing) equipment to generate numerical control (Nc) tape program ...
Tends equipment that cleans surface of semiconductor wafers after slicing or polishing: Reviews work...
Plater, Printed Circuit Board Panels
Electroplates printed circuit board (Pcb) panels with metals, such as copper, tin, gold, nickel, or ...
Deburrer, Printed Circuit Board Panels
Feeds and off bears machine that automatically cleans and removes burrs from panels for production o...
Production Technician, Semiconductor Processing Equipment
Cleans and maintains wafer processing machines and equipment and mixes chemical solutions, following...
Tool Programmer, Numerical Control
Operates optical programming (digitizing) equipment to generate numerical control (Nc) tape program ...